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X-Ray Inspection

Primetec provides a complete X-Ray inspection and analysis service. Leading edge X-Ray technology is used to produce the best images. A Complete GE Nanomex X-Ray system including offline station guarantees complete inspection and post-inspection analysis. Software Analysis includes solder joints, list of pins, special pins, packages, JEDEC numbering, BGA, Auto Wire (wire bonding), QFP, MLF, Edge Detection, PTH. A resolution of 200 nanometers, power of 180kV/15W tube, 2Megapixels digital chain and optical zoom up to 24000x can produce very high quality inspection images.

Click here to download our X-Ray Service brochure

main-nanomex-nanofocus-x-ray-system
BGA Soldering analysis
Trace, pad and via analysis
Meniscus overlay analysis
BGA ball shunt
PAD meniscus
PCB overlay analysys
BGA ball overview
QFN open joints
CAD programming

Get your PCBs an X-Ray analysis. Contact us today!

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The X-Ray data analysis process is done offline, using state of the art modeling software. The uAXI has extreme high defect coverage. Offline software is used for fast CAD programming. Analysis software has an outstanding precision and repeatability, allowing small views with a few micrometers, 360º rotation and oblique viewing up to 70º. Our system can be used for 2D and 3D inspection and analysis, contributing for the future of zero defect requirements.

News
  • Inete Technical School anual prize
    May 30, 2013
  • Electronica 2012
    November 20, 2012
  • ISO9001
    July 31, 2011
  • Electronica 2010
    November 20, 2010
  • Microchip Masters 2009
    August 31, 2009
© Primetec - Engenharia de Sistemas, Lda. 2003 - 2015